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Type 1JP

Order Number LBWA1ZZ1JP

Supporting TI SimpleLink Wi-Fi SDK

  • 2.4GHz Wi-Fi Module
  • Network Topology: AP & STA mode
  • Chipset: TI (CC3100)
  • Processor: No
  • Modulation: DSSS / CCK / OFDM
  •  

    Explanation of Product Status

    Under Development Products under development
    Please contact us for product availability and sample lead-time.
    In Production Product is in mass production.
    to be discontinued Not recommended for new designs. We are evaluating the schedule for the discontinuing of production of this item. Contact Murata or refer to the website for details of product supply and possible alternative product information.
    Discontinued product Production of this product has stopped. Contact Murata for inventory availability and possible alternative products.
    Recommended product This product is particularly recommended among our products currently in production.
    New product It's new item.

Type 1JP

Type 1JP Wi-Fi module is a small, low power, self contained, certified embedded Wi-Fi network controller solution for cunsumer grade applications. It is enabled with TI SimpleLink architecture. They host the Wi-Fi, TCP/IP network stack, security supplicant, and other network application features.
Product Type Module
Grade Consumer
Frequency 2.4GHz
Frequency MHz (min) 2400
Frequency MHz (max) 2483.5
Chipset TI (CC3100)
Processor No
Modulation DSSS / CCK / OFDM
Antenna On-board
RF Conn/ Antenna PCB Antenna
System Clock Internal X'tal
Operating Temperature Range -40 to +85
Operating Temperature °C (min) -40
Operating Temperature °C (max) 85
Mounting Type SMT
Package LGA
Dimension 13.2 x 21.45 x 2.45 mm
Supply Voltage (Vdc) 3.3
Supply Voltage min 2.7
Supply Voltage max 3.6
Transmit Power +15dBm @ 11Mbps
+11dBm @ 54Mbps
+10dBm @ 65Mbps
Receiver Sensitivity -88dBm @ 11Mbps
Transmit Mode Current 270mA @ 11Mbps
Receive Mode Current TBD
Data Rate WLAN 11, 54, 65 Mbps
Bluetooth No
WLAN 802.11b/g/n
Technology Wi-Fi
Network AP & STA mode
Host Interface UART/SPI
Host Interface Other GPIO
Interface Voltage (Vdc for VIO) 1.85 (optional)
FCC/IC Certified FCC/IC Certified
ETSI Certified Yes
ECCN 5A992
ISO9001 Yes
TS16969 No
Certification
● CE (Europe) EN 300328 V1.8.1
  Conducted Test Report available
Note: CE marking and declaration should be done by customer as a final product.
Document Statement For latest version of datasheet and other related documents, please access through Support Portal through Support for Wireless Tab on the right side.
Software

To develop software by TI SimpleLink Wi-Fi SDK, please go to TI web site http://www.ti.com/tool/cc3100sdk

The CC3100 SDK contains drivers, many sample applications for Wi-Fi features and internet, and documentation needed to use the CC3100 Internet-on-a-chip™ solution. This SDK can be used with TI’s MSP-EXP430F5529LP LaunchPad, MSP-EXP430FR5969 Wolverine LaunchPad, or SimpleLink Studio, a PC tool that allows MCU development with CC3100. You can also use the SDK as example code for any platform. All sample applications in the SDK are supported on TI’s MSP430F5529 and MSP430FR5969 ultra-low-power MCUs with Code Composer Studio IDE and TI RTOS. In addition, many of the applications support IAR & GCC.

Development Kit LBEWA1ZZ1JP-TEMP-D
Evaluation Tool For evaluation - order LBWA1ZZ1JP-TEMP-A
Order Number LBWA1ZZ1JP
Sample Part Number LBWA1ZZ1JP-TEMP
Production Part Number TBD
Development Kit Part Number LBEWA1ZZ1JP-TEMP-D
Purchase Annual Volume Requirement of 100K. Please engage with Murata sales team and wireless team to determine if this module is suitable for your applications. Murata reserves the right to support or to not support requests based on corporate policy that includes export control and application restrictions or other requirements. To expedite the qualification of your application for these modules, please submit the information through the Contact Us button on the top.
Order Increment 2,000
Packaging Tape and Reel