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Type 1DX

Order Number LBEE5KL1DX

  • 2.4GHz WiFi + Bluetooth Module
  • Network Topology: AP & STA dual mode
  • Chipset: Cypress (CYW4343W)
  • Processor: No
  • Modulation: DSSS / CCK / OFDM
  •  

    Explanation of Product Status

    Under Development Products under development
    Please contact us for product availability and sample lead-time.
    In Production Product is in mass production.
    to be discontinued Not recommended for new designs. We are evaluating the schedule for the discontinuing of production of this item. Contact Murata or refer to the website for details of product supply and possible alternative product information.
    Discontinued product Production of this product has stopped. Contact Murata for inventory availability and possible alternative products.
    Recommended product This product is particularly recommended among our products currently in production.
    New product It's new item.

Type 1DX

The Type 1DX module is an ultra-small module that includes 2.4GHz WLAN and Bluetooth functionality. Based on Cypress CYW4343W, the module provide high-efficiency RF front end circuits. The module is designed to fit into small spaces and is smaller than a dime. Minimal external circuitry is required to complete a radio design; add an antenna, power source, clocks, processor, and associated interface hardware and the radio hardware design is complete. To ease Wi-Fi certification, the Type 1DX module complies with IEEE 802.11b/g/n and Bluetooth Version 4.1 plus EDR, Power Class 1 (10dBm max) + BLE. Software is available for Linux and Android.
Product Type Module
Grade Consumer
Frequency 2.4GHz
Frequency MHz (min) 2400
Frequency MHz (max) 2483.5
Chipset Cypress (CYW4343W)
Processor No
Modulation DSSS / CCK / OFDM
Embedded Stack No
Antenna External
System Clock Internal X'tal
Operating Temperature Range -30 to +70
Operating Temperature °C (min) -30
Operating Temperature °C (max) 70
Mounting Type SMT
Package LGA
Dimension 6.95 x 5.15 x 1.1 mm
Supply Voltage (Vdc) 3.6
Supply Voltage min 3.35 for VBAT
Supply Voltage max 4.2 for VBAT
Transmit Power +17dBm @ 11Mbps (2.4GHz)
+13dBm @ 54Mbps (2.4GHz)
+12dBm @ 65Mbps
Receiver Sensitivity -89dBm @ 11Mbps (2.4GHz)
-75dBm @ 54Mbps (2.4GHz)
-73dBm @ 65Mbps (2.4GHz)
Transmit Mode Current 320mA @ 11Mbps
270mA @ 54Mbps
260mA @ 65Mbps
Receive Mode Current 47mA @ 11Mbps (2.4GHz)
47mA @ 54Mbps (2.4GHz)
47mA @ 65Mbps (2.4GHz)
Data Rate WLAN 11, 54, 65 Mbps
Data Rate Bluetooth 3Mbps
WLAN 802.11b/g/n
Bluetooth v4.1+EDR
Power Class Class 1
Technology WiFi + Bluetooth
Network AP & STA dual mode
Host Interface SDIO
I/O Interface PCM for Bluetooth audio
Host Interface Other No
Host Interface BT UART
Interface Voltage (Vdc for VIO) 1.8 or 3.3
FCC/IC Certified Yes
ETSI Certified Yes
ECCN 5A992
ISO9001 Yes
TS16969 No
Document Statement If you use NXP i.MX6 platforms that is described in this landing page (http://wireless.murata.com/eng/products/rf-modules-1/wi-fi-bluetooth-for-nxp-i-mx.html), please read "Quick Start Guide (Linux)" and "Quick Start Guide (Adnroid)". For further development on i.MX6, we have additional documents in our support site (myMurata). Please refer to "Support Site Access Guide" under software tab to learn how to access to myMurata".
Data Sheet Download PDF
Quick Start Guide (Linux) Download PDF
Quick Start Guide (Android) Download PDF
Software Please submit the information through the Contact Us button to initiate a contact into Murata sales or wireless team for more information about software availability.
Support Site Access Guide Download
Driver Firmware Linux / Android driver firmware for i.MX6 platform
Evaluation Tool i.MX6 reference platform
Order Number LBEE5KL1DX
Purchase Annual Volume Requirement of 100K. If you use NXP i.MX6 with Linux/Android OS, the annual volume requirement is 50K. Please engage with Murata sales team and wireless team to determine if this module is suitable for your applications. Murata reserves the right to support or to not support requests based on corporate policy that includes export control and application restrictions or other requirements. To expedite the qualification of your application for these modules, please submit the information through the Contact Us button on the top.
Packaging Tape and Reel