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Type 1CX

Order Number LBEH5UL1CX

Dual band WiFi 11a/b/g/n/ac 2x2 MIMO with Bluetooth 4.1

  • 2.4GHz & 5 GHz 2.4GHz & 5 GHz WiFi + Bluetooth Module
  • Network Topology: AP and STA dual mode
  • Chipset: Cypress (CYW4356)
  • Modulation: DSSS / CCK / OFDM

High Performance Capabilities for Internet of Things

  • For IoT, Smart Home, Audio/4K Video/Voice, Gateway
  • 802.11 a/b/g/n/ac 2x2 MIMO 866Mbps
  • Shielded Package
  • Recommended In Production  

    Explanation of Product Status

    Under Development Products under development
    Please contact us for product availability and sample lead-time.
    In Production Product is in mass production.
    to be discontinued Not recommended for new designs. We are evaluating the schedule for the discontinuing of production of this item. Contact Murata or refer to the website for details of product supply and possible alternative product information.
    Discontinued product Production of this product has stopped. Contact Murata for inventory availability and possible alternative products.
    Recommended product This product is particularly recommended among our products currently in production.
    New product It's new item.

Type 1CX

Type 1CX is a small and very high performance module based on Cypress CYW4356 combo chipset which support WiFi 802.11a/b/g/n/ac 2x2 MIMO + Bluetooth 4.1 BR/EDR/LE up to 866Mbps PHY data rate on Wifi and 3Mbps PHY data rate on Bluetooth. The WLAN section supports PCIe v3.0 interface and the Bluetooth section supports high-speed 4-wire UART interface and PCM for audio data.

The CYW4356 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorighms, which ensure that WLAN and Bluetooth collaboration is optimized for maximum performance.

In IEEE 802.11ac mode, the WLAN operation supports rates of MCS0 - MSC9 (up to 256 QAM) in 20MHz, 40MHz and 80MHz channels for data rate up to 866Mbps.

Type 1CX module is packaged in an impressively small form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more.

Product Type Module
Grade Consumer
Frequency 2.4GHz & 5 GHz
Chipset Cypress (CYW4356)
Modulation DSSS / CCK / OFDM
Antenna External
System Clock Internal X'tal
Operating Temperature Range -20 to +75
Operating Temperature °C (min) -20
Operating Temperature °C (max) 75
Mounting Type SMT
Package LGA
Dimension 11.5 x 8.8 x 1.05mm
Supply Voltage (Vdc) 3.35 - 4.2
Transmit Power 18 dBm @ 11b (2.4GHz)
15.5 dBm @ 11g (2.4GHz)
14.5 dBm @ 11n (2.4GHz)
14.5 dBm @ 11a (5GHz)
13.5 dBm @ 11n (5GHz)
11.5 dBm @ 11ac (5GHz)
Receiver Sensitivity -57 dBm @ 866Mpbs (5GHz)
Transmit Mode Current 450mA @ 11b (2.4GHz)
370mA @ 11g (2.4GHz)
320mA @ 11n (2.4GHz)
370mA @ 11a (5GHz)
350mA @ 11n (5GHz)
380mA @ 11ac (5GHz)
Receive Mode Current 170mA @ 866Mbps (5GHz)
Data Rate WLAN 866 Mbps
Data Rate Bluetooth 3 Mbps
WLAN 802.11a/b/g/n/ac 2x2 MIMO
Bluetooth v4.1+EDR
Power Class Class 1
Technology 2.4GHz & 5 GHz WiFi + Bluetooth
Network AP and STA dual mode
Host Interface PCIe
Host Interface Other No
Host Interface BT UART
Host Interface BT Other PCM
Interface Voltage (Vdc for VIO) 1.8 or 3.3
FCC/IC Certified No
ETSI Certified No
ISO9001 Yes
TS16969 No
Platform Linux
Quick Start Guide (Linux) Download PDF
Software

To develop software on Linux, please visit (https://wireless.murata.com/eng/products/rf-modules-1/wi-fi-bluetooth-for-nxp-i-mx.html)

Support Site Access Guide Download
Driver Firmware

Linux driver firmware for i.MX6 platform

Evaluation Tool
  • i.MX reference platform for Linux (https://wireless.murata.com/eng/products/rf-modules-1/wi-fi-bluetooth-for-nxp-i-mx.html)
  • Order Number LBEH5UL1CX
    Purchase

    Please engage with Murata sales team and wireless team to determine if this module is suitable for your applications.

    Murata reserves the right to support or not to support requests based on the corporate policy that includes export control and application restrictions, annual volume requirement (100kpcs) or other requirements.

    To expedite the qualification of your application for these modules, please submit the information through the Contact Us button on the top.

    Packaging Tape and Reel