Type 1LV
Dual band WiFi 11a/b/g/n with Bluetooth 5.0 2Mbps PHY
- 2.4GHz & 5 GHz 2.4GHz & 5 GHz WiFi + Bluetooth Module
- Network Topology: AP and STA dual mode
- Chipset: Cypress (CYW43012)
- Modulation: DSSS / CCK / OFDM
Best-in-class Low Power Consumption
- For Battery Powered, IoT, Smart Home, Audio/Video/Voice, Gateway
- 802.11 a/b/g/n, ac-friendly 78Mbps
- Capable for running TCP/IP/Bluetooth inside
Explanation of Product Status 
Products under development
Please contact us for product availability and sample lead-time.Product is in mass production. 
Not recommended for new designs. We are evaluating the schedule for the discontinuing of production of this item. Contact Murata or refer to the website for details of product supply and possible alternative product information. 
Production of this product has stopped. Contact Murata for inventory availability and possible alternative products. This product is particularly recommended among our products currently in production. 
It's new item.
In IEEE 802.11ac-friendly mode, the WLAN operation supports MCS8 (256 QAM) in 20MHz channel for data rate up to 78Mbps.
The CYW43012 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorighms, which ensure that WLAN and Bluetooth collaboration is optimized for maximum performance.
Embedded IPv6 network stack for use with WICED SDK and TCP keepalive is handled internally, so that host processor can keep sleeping.
In addition to Bluetooth 5.0 2Mbps PHY support, all of optional Bluetooth 4.2 features, LE Secure Connections, LE Privacy 1.2 and LE Data Packet Length Extension, are supported.
Type 1LV module is packaged in an impressively small sheilded form factor that facilitates integration into size- and power-sensitive applications such as IoT applications, handheld wireless system, gateway and more.
| Product Type | Module |
| Grade | Consumer |
| Frequency | 2.4GHz & 5 GHz |
| Chipset | Cypress (CYW43012) |
| Modulation | DSSS / CCK / OFDM |
| Antenna | External |
| System Clock | Internal X'tal |
| Operating Temperature Range | -20 to +70 |
| Operating Temperature °C (min) | -20 |
| Operating Temperature °C (max) | 70 |
| Mounting Type | SMT |
| Package | LGA |
| Dimension | 10.0 x 7.2 x 1.4mm |
| Supply Voltage (Vdc) | 3.2 - 4.4 |
| Transmit Power | 17 dBm @ 11b (2.4GHz) 14 dBm @ 11g (2.4GHz) 13 dBm @ 11n (2.4GHz) 13 dBm @ 11a (5GHz) 12 dBm @ 11n (5GHz) 10 dBm @ 11ac (5GHz) |
| Receiver Sensitivity | -59 dBm @ 78Mpbs (5GHz) |
| Transmit Mode Current | 200mA @ 11b (2.4GHz) 150mA @ 11g (2.4GHz) 140mA @ 11n (2.4GHz) 230mA @ 11a (5GHz) 210mA @ 11n (5GHz) 190mA @ 11ac (5GHz)" |
| Receive Mode Current | 20mA @ 78Mbps (5GHz) |
| Data Rate WLAN | 78 Mbps |
| Data Rate Bluetooth | 3 Mbps |
| WLAN | 802.11a/b/g/n/ac |
| Bluetooth | v5.0+EDR |
| Power Class | Class 1 |
| Technology | 2.4GHz & 5 GHz WiFi + Bluetooth |
| Network | AP and STA dual mode |
| Host Interface | SDIO |
| Host Interface BT | UART |
| Host Interface BT Other | PCM, I2S |
| Interface Voltage (Vdc for VIO) | 1.8 |
| FCC/IC Certified | No |
| ETSI Certified | No |
| CE Compliant | CE Compliant |
| ISO9001 | Yes |
| TS16969 | No |
| Platform | Linux, WICED |
| Quick Start Guide (Linux) | Download PDF |
| Software | To develop software on Linux, please visit (https://wireless.murata.com/eng/products/rf-modules-1/wi-fi-bluetooth-for-nxp-i-mx.html) To develop software on RTOS, please visit Cypress WICED web site (https://community.cypress.com/community/wiced-wifi) |
| Support Site Access Guide | Download |
| Driver Firmware | Linux driver firmware for i.MX6 platform RTOS driver firmware for Cypress WICED (coming soon) |
| Evaluation Tool |
| Order Number | LBEE59B1LV |
| Purchase | Please engage with Murata sales team and wireless team to determine if this module is suitable for your applications. Murata reserves the right to support or not to support requests based on the corporate policy that includes export control and application restrictions, annual volume requirement (100kpcs) or other requirements. To expedite the qualification of your application for these modules, please submit the information through the Contact Us button on the top. |
| Packaging | Tape and Reel |