Type 1JP

Type 1JP
  • Description
  • Specs
  • Documents
  • Software
  • Block Diagram
  • Eval Tool
  • Purchase
Type 1JP Wi-Fi module is a small, low power, self contained, certified embedded Wi-Fi network controller solution for cunsumer grade applications. It is enabled with TI SimpleLink architecture. They host the Wi-Fi, TCP/IP network stack, security supplicant, and other network application features.
Annual Volume 100,000
Product Type Module
Product Status recommended in production
Grade Consumer
Frequency 2.4GHz
Frequency MHz (min) 2400
Frequency MHz (max) 2483.5
Chipset TI (CC3100)
Processor No
Modulation DSSS / CCK / OFDM
Embedded Stack Yes
Antenna On-board
RF Conn/ Antenna PCB Antenna
Sleep Clock No
System Clock Internal X'tal
Operating Temperature Range -40 to +85
Operating Temperature °C (min) -40
Operating Temperature °C (max) 85
Mounting Type SMT
Package LGA
Dimension 13.2 x 21.45 x 2.45 mm
Supply Voltage (Vdc) 3.3
Supply Voltage min 2.7
Supply Voltage max 3.6
Transmit Power +15dBm @ 11Mbps
+11dBm @ 54Mbps
+10dBm @ 65Mbps
Receiver Sensitivity -88dBm @ 11Mbps
Transmit Mode Current 270mA @ 11Mbps
Receive Mode Current TBD
Data Rate WLAN 11, 54, 65 Mbps
Bluetooth No
WLAN 802.11b/g/n
Technology WiFi
Network AP and STA mode
Host Interface UART/SPI
I/O Interface GPIO
Host Interface Other No
Interface Voltage (Vdc for VIO) 1.85 (optional)
FCC/IC Certified FCC/IC Certified
ETSI Certified Yes
ECCN 5A992
ISO9001 Yes
TS16969 No
CE (Europe) EN 300328 V2.1.1
  Conducted Test Report available
Note: CE marking and declaration should be done by customer as a final product.
Document Statement For latest version of datasheet and other related documents, please engage with Murata sales team and wireless team to determine if this module is suitable for your applications.

To develop software by TI SimpleLink Wi-Fi SDK, please go to TI web site http://www.ti.com/tool/cc3100sdk

The CC3100 SDK contains drivers, many sample applications for Wi-Fi features and internet, and documentation needed to use the CC3100 Internet-on-a-chip™ solution. This SDK can be used with TI’s MSP-EXP430F5529LP LaunchPad, MSP-EXP430FR5969 Wolverine LaunchPad, or SimpleLink Studio, a PC tool that allows MCU development with CC3100. You can also use the SDK as example code for any platform. All sample applications in the SDK are supported on TI’s MSP430F5529 and MSP430FR5969 ultra-low-power MCUs with Code Composer Studio IDE and TI RTOS. In addition, many of the applications support IAR & GCC.

Driver Firmware TI SimpleLink Wi-Fi SDK
Block Diagram : Type 1JP
Evaluation Tool For evaluation - order LBWA1ZZ1JP-TEMP-A
Sample Part Number LBWA1ZZ1JP-TEMP
Production Part Number LBWA1ZZ1JP-928
Development Kit Part Number LBEWA1ZZ1JP-TEMP-D

Please engage with Murata sales team and wireless team to determine if this module is suitable for your applications.

Murata reserves the right to support or not to support requests based on the corporate policy that includes export control and application restrictions, annual volume requirement (100kpcs) or other requirements.

To expedite the qualification of your application for these modules, please submit the information through the Contact Us button on the top.

Order Increment 2,000