Type 1JP
Type 1JP
Shielded Small WiFi 11b/g/n+MCU Module
- 2.4GHz WiFi Module
- Network Topology: AP and STA mode
- Chipset: TI (CC3100)
- Processor: No
- Modulation: DSSS / CCK / OFDM
Supporting TI SimpleLink Wi-Fi SDK
- For Industrial IoT, Smart Home, Sensor Network
- 802.11 b/g/n 65Mbps, Wifi Stack runs inside
- Description
- Specs
- Documents
- Software
- Block Diagram
- Eval Tool
- Purchase
| Type 1JP Wi-Fi module is a small, low power, self contained, certified embedded Wi-Fi network controller solution for cunsumer grade applications. It is enabled with TI SimpleLink architecture. They host the Wi-Fi, TCP/IP network stack, security supplicant, and other network application features. |
| Annual Volume | 100,000 | ||||||||
| Product Type | Module | ||||||||
| Product Status | recommended in production | ||||||||
| Grade | 4646 | ||||||||
| Frequency | 2.4GHz | ||||||||
| Frequency MHz (min) | 2400 | ||||||||
| Frequency MHz (max) | 2483.5 | ||||||||
| Chipset | TI (CC3100) | ||||||||
| Processor | No | ||||||||
| Modulation | DSSS / CCK / OFDM | ||||||||
| Embedded Stack | Yes | ||||||||
| Antenna | On-board | ||||||||
| RF Conn/ Antenna | PCB Antenna | ||||||||
| Sleep Clock | No | ||||||||
| System Clock | Internal X'tal | ||||||||
| Operating Temperature Range | -40 to +85 | ||||||||
| Operating Temperature °C (min) | -40 | ||||||||
| Operating Temperature °C (max) | 85 | ||||||||
| Mounting Type | SMT | ||||||||
| Package | LGA | ||||||||
| Dimension | 13.2 x 21.45 x 2.45 mm | ||||||||
| Supply Voltage (Vdc) | 3.3 | ||||||||
| Supply Voltage min | 2.7 | ||||||||
| Supply Voltage max | 3.6 | ||||||||
| Transmit Power |
+15dBm @ 11Mbps +11dBm @ 54Mbps +10dBm @ 65Mbps |
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| Receiver Sensitivity | -88dBm @ 11Mbps | ||||||||
| Transmit Mode Current | 270mA @ 11Mbps | ||||||||
| Receive Mode Current | TBD | ||||||||
| Data Rate WLAN | 11, 54, 65 Mbps | ||||||||
| Bluetooth | No | ||||||||
| WLAN | 802.11b/g/n | ||||||||
| Technology | WiFi | ||||||||
| Network | AP and STA mode | ||||||||
| Host Interface | UART/SPI | ||||||||
| I/O Interface | GPIO | ||||||||
| Host Interface Other | No | ||||||||
| Interface Voltage (Vdc for VIO) | 1.85 (optional) | ||||||||
| FCC/IC Certified | FCC/IC Certified | ||||||||
| ETSI Certified | Yes | ||||||||
| ECCN | 5A992 | ||||||||
| ISO9001 | Yes | ||||||||
| TS16969 | No | ||||||||
| Certification |
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| Document Statement | For latest version of datasheet and other related documents, please engage with Murata sales team and wireless team to determine if this module is suitable for your applications. |
| Software |
To develop software by TI SimpleLink Wi-Fi SDK, please go to TI web site http://www.ti.com/tool/cc3100sdk The CC3100 SDK contains drivers, many sample applications for Wi-Fi features and internet, and documentation needed to use the CC3100 Internet-on-a-chip™ solution. This SDK can be used with TI’s MSP-EXP430F5529LP LaunchPad, MSP-EXP430FR5969 Wolverine LaunchPad, or SimpleLink Studio, a PC tool that allows MCU development with CC3100. You can also use the SDK as example code for any platform. All sample applications in the SDK are supported on TI’s MSP430F5529 and MSP430FR5969 ultra-low-power MCUs with Code Composer Studio IDE and TI RTOS. In addition, many of the applications support IAR & GCC. |
| Driver Firmware | TI SimpleLink Wi-Fi SDK |
|
| Evaluation Tool | For evaluation - order LBWA1ZZ1JP-TEMP-A |
| Sample Part Number | LBWA1ZZ1JP-TEMP |
| Production Part Number | LBWA1ZZ1JP-928 |
| Development Kit Part Number | LBEWA1ZZ1JP-TEMP-D |
| Purchase |
Please engage with Murata sales team and wireless team to determine if this module is suitable for your applications. Murata reserves the right to support or not to support requests based on the corporate policy that includes export control and application restrictions, annual volume requirement (100kpcs) or other requirements. To expedite the qualification of your application for these modules, please submit the information through the Contact Us button on the top. |
| Order Increment | 2,000 |